2025 SEE/MAPLD Workshop Call for Papers
Click here for a Call for Papers PDF
We are seeking contributions in the areas below, but all submissions will be reviewed. Four sessions are available: SEE, MAPLD, Combined, and Poster. The Combined Session includes submissions that cross SEE and MAPLD themes. The Poster Session can include SEE, MAPLD, or Combined content. Please refrain from technical content reasonably classified as product marketing. Paper submission deadline has been extended to February 28, 2025.
We especially encourage submissions focusing on, but not limited to:
Space Radiation Environment
Standards and methods (new or adapted)
Heavy-ion, proton, and alternative SEE testing
Test Facility Updates
Space Environments
Modeling and Simulation Approaches (new or adapted)
Applications of AI/ML to SEE testing, analysis, and mitigation
Mission Applications & Highlights Enabled by FPGAs/SoCs
Device Failure Modes & Reliability
Reconfigurable High-Performance Computing, Evolvable Hardware, & Security
NextGen Platforms and Sensors Enabled by FPGAs/SoCs
Tool Enablement

Abstract Submission Guidelines:

We accept Microsoft Word .docx, Microsoft Powerpoint .pptx, or Adobe .pdf only.

If you choose to submit a Word or PDF abstract: Please keep submission to a minimum of 1 and a maximum of 4 pages.

If using PowerPoint, your charts should provide a title page with authors and affiliations,
motivation / context / overview, available relevant results, and anticipated conclusions.

To get started, please make use of our supplied templates:


Click here for SEE-MAPLD Abstract Submission
The conference committee will attempt to notify all prospective speakers of acceptance status by March 31st.
 
SEE Symposium / Combined* / MAPLD Session Options
Single-Event Phenomena, Mechanisms & Modeling: Upsets, Functional Interrupts, Transients, Latchup, Gate Rupture, Burnout, etc. Destructive and Non-Destructive Effects, Nanoscale Phenomena, Charge Transport and Collection, Impact of Circuit and Environmental Parameters, etc. FPGAs/SoCs, PLDs, New Devices, and Design: Novel FPGA and PLDs; Benchmarking; Applications of space-borne processing. Agile methods, ESL/HLS and model-based engineering techniques, embedded processing, and synthesis efficiency improvements.
SEE Mitigation: Device Level SEE Mitigation Methods including Radiation Hardened by Design (RHBD) and by Process (RHBP): Approaches for gaining SEE hardness in commercial devices, etc. SEE Mitigation: Circuit and System Level: Multi-level approaches for high reliability and fault tolerance (RHBD, redundancy, TMR, SET filtering, etc.), upset mitigation techniques, automated tools, etc.
Environments and Facilities: Space, Atmospheric, and Terrestrial environments. Heavy-Ion, Proton, Neutron, Pulsed Laser, and Other Test Facilities. Correlation between environment and test. Validation and Verification:Techniques and languages such as co-simulation, System Verilog and OVM/UVM, etc. Simulation, emulation, new tools and methods for design validation.
Device Data and Measurement: Techniques for Memories, Analog/Digital Circuits, Systems-on-Chip (SoCs), FPGAs, Optocouplers, Photonic ICs, Power Converters, Sensors, etc. Availability, Reliability, and Susceptibility: Failure mechanisms, reliability testing and characterization, packaging reliability, reliable design practices.
Case Study: Devices and SystemsOperational Regimes and Performance Data for Systems and Devices from LEO to Interplanetary, High Altitude Aircraft, and Terrestrial. Case Study: Computing, Logic, and Processing: Novel applications of Reconfigurable computing, high-performance processing and successful deployment of programmable logic, etc.
Systems and Error Rate Computation: Error Mitigation, EDAC, Multi-core Processing, and Fault Tolerant Systems; Analytic, Monte Carlo, Mixed-Level, methods, etc. Research and Education: Education Practices, Market Demands, and Retention. Training course overview and organization, Degree programs, Relevant future trainings 2025.
Artificial Intelligence (AI) / Machine Learning (ML) in FPGAs/SoCs: AI / ML design considerations for reliable terrestrial, avionic, and aerospace applications; using AI for SEE mitigation; SEE evaluation of designs leveraging AI / ML
*All options subject to change any time, per the discretion of the conference committee